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Industria News
Omnino explicatio processus fabricandi chip (2/2): ab lagano ad packaging et probatio
Depositio tenuis pellicularum est vitalis in fabricandis chippis, fabricandis micronicis deponendis cinematographicis sub 1 grossis micron per CVD, ALD vel PVD. Hi processus semiconductores componentes per alternas pelliculas conductivas et insulantes aedificant.
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Omnino explicatio processus fabricandi chip (1/2): ab lagano ad packaging et probatio
Processus semiconductor fabricationis octo gradus involvit: laganum processus, oxidatio, lithographia, etching, tenuis depositionis pelliculae, connexio, probatio et packaging. Silicon ab arena discursum est in lagana, oxidized, ortae, et in gyris accuratissime notatis.
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Quantum scis de sapphiro?
Articulus hic describit quod substratum ducatur maximam applicationem sapphiri, ac methodos praecipuas parandi crystallos sapphiri: sapphiri crystallis per methodum Czochralski crescendi, sapphiri crystallis per methodum Kyropoulos crescendo, sapphiri crystallis crescendo per modum ducti formarum, a......
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